Layout & Spacers
The Spacers & Layout tab controls how cells are packed inside the envelope and how printed support plates are generated around them.
Primary controls
Pattern
Choose
Hex for dense staggered packing or Rect for row/column layouts that are easier to inspect and wire.Cell spacing
Sets the radial and axial gap between cell centers beyond cell diameter. The minimum is clamped to keep geometry stable.
Spacer lip
Controls material left around cell holes in spacer plates. Larger lips are stronger but consume more usable area.
Stack
Toggles the floating stack breakdown panel, which shows vertical buildup across cells, gaps, spacers, busbar pockets, and case features.
Advanced spacer options
- Spacer height: printed spacer thickness around each cell layer.
- Ring height: protruding ring lip height that engages cells or adjacent stack features.
- Ring inner diameter: inner opening of the ring lip; zero disables rings.
- Spacer offset: moves spacers vertically to line up with case or busbar features.
- Busbar pocket depth: recesses busbar geometry into spacer plates.
- Layer gap: vertical distance between stacked cell layers.
- Fill layer gap with solid plate: adds a separate spacer plate between layers using the same outline.
How packing is computed
- BatteryBee samples the Geometry outline and builds a viewer outline in millimeters.
- Wall thickness creates an inner packing outline when Case is enabled.
- Clearance, cell radius, wall guard, spacer lips, and keep-outs are applied before cell centers are accepted.
- The generator tests several phase offsets and keeps the pattern with the most valid cells.
- Vertical layer count comes from depth, cell height, layer gap, wall clearance, spacer lips, and busbar pocket lift.
Why cells may disappear
A small change in spacing, wall thickness, clearance, ring height, or keep-out position can remove a whole row or layer when a cell no longer fits fully inside the valid packing outline.
Practical tuning
- Start with Hex and 1 mm spacing for dense cylindrical packs, then move to Rect if wiring readability matters more than density.
- Increase edge clearance before increasing the envelope when you need more wall-to-cell margin.
- Keep spacer lip and ring settings realistic for your print process; overly thin rings may break during assembly.
- Use busbar pocket depth only after busbar plate thickness is known.
- Revisit the Geometry depth when layer count is one short of target; vertical stack constraints often explain the shortfall.