Glossary

Key terms used across the app.

Core

  • Series (S): number of cells in series used to determine voltage.
  • Parallel (P): number of cells in parallel used to determine capacity.
  • Envelope: the 2D outline and height that defines the pack’s external shape.

Case

  • Wall thickness: thickness of the rendered enclosure walls (mm).
  • Edge clearance: distance from outermost cells to the case wall (mm); does not change cell spacing.
  • Chamfer: bevel applied to case edges; limited to half the wall thickness.
  • Lid: a removable face on Top/Bottom or a specific side edge of the case.
  • Cutout: a feature removed from the case (round, rectangular, slot, D‑key).

Components

  • Spacer: printed parts used to align/support cells; unique shapes can be exported as STLs.
  • Busbar: conductive layer with rails and bridges connecting series lanes; exported as DXF/SVG.
  • Keep‑out: a planning volume reserved for hardware or cable paths; hidden while painting series.