Glossary
Terms used across the BatteryBee designer, geometry pipeline, case editor, busbar tools, and exports.
Pack planning
- Series (S): cells connected in series; primary driver for pack voltage.
- Parallel (P): cells connected in parallel; primary driver for capacity and current sharing.
- Target: the desired S/P configuration entered by the user.
- Actual: the S/P result represented by generated slots and painted assignments.
- Effective parallel: the usable parallel count after geometry, keep-outs, or assignment constraints reduce capacity.
- Series lock: saved state that prevents accidental wiring and geometry changes after series lanes are valid.
Geometry and layout
- Envelope: the 2D footprint and depth that define available pack volume.
- Depth: the envelope base height in millimeters.
- Hex layout: staggered cylindrical-cell packing for higher density.
- Rect layout: row/column packing for easier inspection and simpler wiring.
- Keep-out: reserved volume that removes cell slots and spacer material.
- Spacer: printed support geometry around cells.
- Layer gap: vertical distance between stacked cell layers.
- Spacer lip: material left around cell holes in spacer plates.
- Busbar pocket: recess in a spacer plate to clear busbar thickness.
Case
- Wall thickness: shell wall size in millimeters.
- Chamfer: bevel applied to case edges, clamped to safe dimensions by the geometry engine.
- Clearance: extra distance between cells and case walls.
- Printed case: unified shell with optional removable lids.
- Panelized case: body with explicit removable panels on selected faces.
- Bossed case: monolithic side shell with top/bottom covers that screw into bosses.
- Lid: removable face in printed case mode.
- Panel: removable face in panelized case mode.
- Cutout: round or rectangular removed feature, hosted by the case or a lid/panel.
- Mount: generated external mounting feature, such as a triangle mount or square mount with slot.
- STL import: reference mesh shown in the workspace but not treated as generated case geometry.
Wiring and busbars
- Paint mode: Series tab interaction for assigning cells to series groups.
- Contiguity: each series group stays connected within a layer.
- Connection transition: adjacent series pair used to evaluate busbar contact quality.
- Bridge: intentional connection when adjacent series do not naturally share enough contact.
- Busbar layer: conductive plate settings used for rails and bridges.
- Cap type: busbar opening style at cell terminals, such as slit or cutout.
- Fold zone: selected busbar area that adds a bend tail to flat exports.
- Layer side flip: per-cell-layer front/back reversal for busbar placement.
Exports and reports
- STL: mesh format commonly used for 3D printing and quick geometry checks.
- STEP: CAD solid format recommended for CNC/CAM and downstream CAD review.
- DXF: 2D vector format used for flat outlines and cutting workflows.
- Breakdown: optional export of subparts such as wall panels, plates, and rings.
- Slicing: optional tiling of large solids to fit a printer bed.
- Sag: voltage drop under load estimated from resistance and current assumptions.
- OCV curve: open-circuit voltage curve by state of charge.